Photochemical Machining

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We have over four decades of experience in manufacturing photochemically etched components for the military and aerospace markets. Optical encoders, lead frame prototypes, and R/F shielding components are some of the common photochemically machined products that we manufacture. Elcon specializes in processing diverse base materials, including molybdenum, tungsten, copper, stainless steel, and titanium, with thicknesses ranging from 0.0005" to 0.100". Technical designs for your projects are created by our CAD/CAM department. Using Optibeam printers, photographic artwork designed from custom specifications are plotted on to photoresists that preserve surface metal during photo etching. After the imaging phase, we use Chemcut etchers to remove undesired areas from metal surfaces. Our photochemical etching process offers several advantages, including low cost tooling, design flexibility, fast turnaround, and dimensional repeatability. Flat as well as 3D curved surfaces can be precisely etched to tight tolerances of up to 0.00025". Through chemical milling, we accurately etch holes and slots on a wide range of materials. The minimum hole diameter and spacing between holes can be 1.5 times the material thickness. Our average lead time is 3 weeks ARM for planar and 8 weeks ARM for 3D Grids. Expediting services are also available.

Specifications

Photochemical Machining Process (See Process Description Below) 3D Photoetching Step Etching Half Etching Alternative Naming Conventions for Photochemical Machining Chemical Milling Chemical Machining Photo Milling Photochemical Milling Photo Etching Photochemical Etching Additional Design Capabilities CAD Design CAM Programming Materials (Metals) Molybdenum Tungsten Tungsten-Copper Hastoly Copper-Molybdenum Hafnium Amzirc Copper Alloy Steels Alloy 42 Alloy 46 Gold Beryllium Brass Phosphorous Bronze Iron Inconel Nickel Palladium Stainless Steel Titanium Nitinol Palco Characteristics/Benefits Low Cost Fast Turnaround Design Flexibility Dimensional Repeatability Photochemical Etching and Chemical Machining Equipment Chemcut Etchers Optibeam Printers Industry Focus Department of Defense Department of Energy Solar Product Manufacturing Aerospace Biomedical Communications Computer and Electronics Vacuum Electronics Medical Military Semiconductor Optical Intended Applications for Photochemical Machined Products Fiber Optics R/F shielding Optical Encoders Lead Frame Prototype Aerospace Components Traveling Wave Tube Shadow and Control Grids (TWT) Vacuum Electronics Microwave Transmitting Tubes Medical Components Minimum Material Thickness 0.0005 inches (in) 0.0012 centimeters (cm) 0.0127 millimeters (mm) Maximum Material Thickness 0.100 inches (in) 0.002 centimeters (cm) 0.025 millimeters (mm) Minimum Hole Diameter 1.5 x Material Thickness Minimum Space between features 1.5 x Material Thickness Minimum 3D Photo Etching on a curve surface c over r 66% Min Diameter=0.07 inches Min Thickness=0.002 inches Maximum 3D Photo Etching on a curve surface c over r 66% Max Diameter=18 inches Max Thickness=0.007 inches Maximum Sheet Length 2 feet (ft) 24 inches (in) 0.61 meters (m) 60.69 centimeters (cm) 609.60 millimeters (mm) Maximum Sheet Width 1.66 feet (ft) 20 inches (in) .508 meters (m) 50.8 centimeters (cm) 508 millimeters (mm) Typical Sheet Sizes 12 x 12 Inches 12 x 18 Inches 9 x 12 inches 6 x 12 inches Tolerance 24 x 20 flat sheet +0.005 inch -0.005 inch Tolerance 6 x 6 flat sheet +0.00025 inch -0.00025 inch Tolerance for a curve surface ( @ .07" Diameter ) +0.0005 inch -0.0005 inch Tolerance for a curve surface (@ 18" Diameter ) +0.002 inch -0.002 inch Production Volume Prototype Production High Volume Testing Capabilities Plating Functional Testing XRF to Check Thickness SPC and PFMEA Typical Lead Times Available 3 Weeks ARM For Planar and 8 Weeks ARM For 3D Grids Expediting Services Available Secondary Services Offered Plating (Gold, Nickel, Silver, and Copper) Forming Machining Brazing Desired File Formats AutoCAD (DWG, DXF) Mechanical Desktop (DWG) Inventor ( IAM, IPT, IDW) SAT STEP IGES SolidWorks (SLDASM, SLDDRW, SLDPRT) Standards ISO 9001:2008 AS 9100 MIL-G-45204 (Gold Plating) AMS-QQ-N-290 (Nickel Plating) QQ-S-365D (Silver Plating) MIL-C-14550B (Copper Plating) Location 1009 Timothy Drive, San Jose, CA 95133 USA Photochemical Machining Is a process of using photoresist to preserve the surface of metal, while using an etchant to dissolve away selected areas.

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